| 作者 |
| 何金良 |
| 丛书名 |
| 出版社 |
| 清华大学出版社 |
| ISBN |
| 9787302533368 |
| 简要 |
| 简介 |
| 内容简介 金属氧化物压敏电阻是电力和电子系统的关键保护器件,直接决定系统运行的安全可靠性。本书系统介绍了氧化锌等压敏电阻的基础研究、制备工艺、性能调控及应用进展,包括导电及老化机理、微结构电特性、微结构测试及微结构仿真分析、高梯度低残压氧化压敏陶瓷、氧化钛及氧化锡等其他体系压敏陶瓷的研究进展等,构建了压敏电阻微结构特性与宏观特性之间的关联性。 本书可供高校和科研院所电气工程、微电子、材料等专业的师生以及电力传输、电气设备制造等行业的工程技术人员阅读和参考。 |
| 目录 |
| 1 Introduction of Varistor Ceramics 1 1.1 ZnOVaristors 1 1.2 FabricationofZnOVaristors 3 1.2.1 PreparationofRawMaterials 4 1.2.2 SinteringofZnOVaristors 5 1.3 Microstructure 6 1.4 TypicalParametersofZnOVaristors 7 1.5 HistoryofZnOVaristors 9 1.6 ApplicationsofZnOVaristors 12 1.7 AlternativeVaristorCeramics 17 1.8 Ceramic–PolymerCompositeVaristors 18 References 22 2 Conduction Mechanisms of ZnO Varistors 31 2.1 Introduction 31 2.2 BasicConceptsinSolid-StatePhysics 33 2.2.1 AtomicEnergyLevelandEnergyBandofCrystal 33 2.2.2 Metal,Semiconductor,andInsulator 35 2.2.3 CharacteristicsofFermi–DiracFunction 37 2.2.4 ImpurityandDefectEnergyLevel 38 2.3 EnergyBandStructureofaZnOVaristor 39 2.3.1 EnergyBandStructureofaZnOGrain 39 2.3.2 DSBofaZnOVaristor 40 2.3.3 MicroscopicOriginofDSB 41 2.3.4 Asymmetric I–V CharacteristicsoftheDSB 43 2.4 ConductionMechanismofaZnOVaristor 45 2.4.1 ConductionModelBasedonThermionicEmissionProcess 46 2.4.2 MinorityCarrierGenerationProcess 49 2.4.3 TheBypassEectModel 51 2.5 DielectricCharacteristicsofaZnOVaristor 51 2.5.1 ExplanationtoDielectricPropertiesofaZnOVaristor 52 2.5.2 EectofInterfacialChargeRelaxationonConductingBehaviorofZnOVaristorsUnderTime-VaryingElectricFields 54 2.5.3 DeterminationofBarrierHeightandRelatedParameters 58 2.5.4 DeterminationofDeepDonorLevelintheZnOVaristor 59 2.5.5 DeterminationofGrainandGrainBoundaryConductivity 60 References 62 3 Tuning Electrical Characteristics of ZnO Varistors 67 3.1 Introduction 67 3.2 Liquid-PhaseFabrication 68 3.2.1 MicrostructureofZnOVaristor 68 3.2.2 PolymorphofBismuthOxide 71 3.2.3 InuenceofBi2O3Concentration 72 3.2.4 VolatilizationofBismuthOxide 72 3.3 PreparingandSinteringTechniques 74 3.3.1 Fabrication 74 3.3.2 FabricationStages 75 3.3.3 EectofPores 76 3.4 RoleofOxygenattheGrainBoundary 78 3.5 DopantEects 79 3.5.1 EectsofAdditives 79 3.5.2 DonorDopants 82 3.5.3 AcceptorDopants 86 3.5.4 AmphotericDopants 87 3.5.4.1 MonovalentDopants 88 3.5.4.2 TrivalentDopants 89 3.5.5 EectsofRareEarthOxides 92 3.5.6 DopantsforImprovingtheStability 93 3.5.7 EvidenceforHydrogenasaShallowDonor 95 3.6 RoleofInversionBoundaries 95 3.7 HighVoltageGradientZnOVaristor 98 3.8 LowResidualVoltageZnOVaristor 101 3.8.1 ResidualVoltageRatio 101 3.8.2 LowResidualVoltageZnOVaristorsbyDopingAl 103 3.8.3 LowResidualVoltageZnOVaristorsbyDopingGa 106 3.8.4 LowResidualVoltageZnOVaristorswithHighVoltageGradient 108 References 110 4 Microstructural Electrical Characteristics of ZnO Varistors 125 4.1 Introduction 125 4.2 MethodstoDetermineGrainBoundaryParameters 126 4.2.1 TheIndirectMethod 126 4.2.2 TheDirectMicrocontactMethods 126 4.3 StatisticalCharacteristicsofGrainBoundaryParameters 129 4.3.1 NonuniformityofBarrierVoltages 129 4.3.2 DistributionofBarrierVoltage 131 4.3.3 DistributionofNonlinearCoecient 132 Contents 4.3.4 DistributionofLeakageCurrentThroughGrainBoundary 133 4.3.5 DiscussiononMicrocontactMeasurement 133 4.4 ClassicationofGrainBoundaries 134 4.5 OtherTechniquestoDetectMicrostructurallyElectricalPropertiesofZnOVaristors 137 4.5.1 ScanningProbeMicroscopy-BasedTechniques 137 4.5.2 GalvanicDeterminationofConductiveAreasonaVaristor Surface 139 4.5.3 LineScanDeterminationofDierencesinBreakdownVoltageWithinaVaristor 141 4.5.4 CurrentImagesinSEM 141 4.6 TestonFabricatedIndividualGrainBoundary 142 4.6.1 ThinFilmApproach 143 4.6.2 SurfaceIn-DiusionApproach 143 4.6.3 BicrystalApproach 143 References 145 5 Simulation on Varistor Ceramics 149 5.1 Introduction 149 5.2 GrainBoundaryModel 151 5.2.1 I–V CharacteristicModelofGrainBoundary 151 5.2.2 GBModelConsideringConductionMechanism 154 5.3 SimulationModelof I–V Characteristics 159 5.3.1 Simple2DSimulationModel 159 5.3.2 2DSimulationModelsBasedontheVoronoiNetwork 161 5.3.3 ConsiderationonPoresandSpinels 164 5.3.4 AlgorithmtoSolveEquivalentCircuit 165 5.3.5 ModelVerication 169 5.4 SimulationModelforThermalCharacteristics 170 5.4.1 ThermalConductionAnalysis 171 5.4.2 Pulse-InducedFractureAnalysis 173 5.5 SimulationsonDierentPhenomena 174 5.5.1 SimulationonMicrostructuralNonuniformity 174 5.5.2 SimulationonCurrentLocalizationPhenomenon 175 5.5.3 InuenceofMicrostructuralParametersonBulkCharacteristics 179 5.5.3.1 InuenceofZnOGrainParameters 180 5.5.3.2 InuenceofGrainBoundaryParameters 183 5.5.4 InuentialFactorsonResidualVoltageRatio 186 References 188 6 Breakdown Mechanism and Energy Absorption Capability of ZnO Varistor 193 6.1 Introduction 193 6.2 ImpulseFailureModesofZnOVaristors 194 6.3 MechanismsofPunctureandFractureFailures 197 6.3.1 MechanismsofPunctureFailure 197 6.3.2 MechanismofFractureFailure 201 6.4 SimulationofPunctureandFractureFailures 204 6.4.1 PunctureDestructionSimulation 204 6.4.1.1 PunctureSimulationinMicrostructure 206 6.4.2 CrackingFailureSimulationinMicrostructure 208 6.5 Thermal Runaway 209 6.5.1 PowerLossofZnOVaristor 210 6.5.2 ThermalRunawayMechanism 210 6.5.3 TeststoEnsuretheThermalStabilityCharacteristics 213 6.6 InuencesofDierentFactorsonFailuresofZnOVaristors 213 6.6.1 InuenceofMicrostructuralNonuniformity 213 6.6.2 InuenceofElectricalNonuniformityinMicrostructure 216 6.6.3 SimulationAnalysisonBreakdownModes 217 6.7 InuentialFactorsonEnergyAbsorptionCapability 218 6.7.1 InuenceoftheAppliedCurrent 218 6.7.2 InuenceofVaristorCross-sectionalArea 221 6.7.3 SimulationAnalysisonSurgeEnergyAbsorptionCapability 221 6.8 DiscussionsonEnergyAbsorptionCapability 225 6.8.1 EnergyAbsorptionCapabilityDeterminedbyFractureFailure 225 6.8.2 EnergyAbsorptionCapabilityDeterminedbyPunctureFailure 226 6.8.3 DiscussiononNonuniformityofEnergyAbsorptionCapability 228 6.8.4 AdditivesEectonEnergyAbsorptionCapability 229 6.8.5 OtherMeasurestoImproveEnergyAbsorptionCapability 230 References 230 7 Electrical Degradation of ZnO Varistors 235 7.1 Introduction 235 7.2 DegradationPhenomenaofZnOVaristors 237 7.2.1 DegradationPhenomenaoftheVaristorBulk 237 7.2.2 DegradationofGrainBoundary 242 7.2.3 PulseDegradationCharacteristics 245 7.2.4 TopographicInformationforDegradationAnalysis 247 7.3 MigrationIonsfortheDegradationofZnOVaristors 249 7.3.1 GrainBoundaryDefectModel 249 7.3.2 ExperimentalProofofIonMigration 251 7.3.3 IdenticationofDominantMobileIons 252 7.3.4 Three-DimensionalExtension 256 7.4 DegradationMechanismofZnOVaristors 257 7.4.1 DCDegradationMechanism 258 7.4.2 ACDegradationMechanism 258 7.4.3 NonuniformDegradationMechanism 260 7.4.4 PulseDegradationofZnOVaristors 262 7.4.4.1 DegradationMechanismUnderImpulseCurrent 263 7.4.4.2 SuperimposingDegradation 264 7.5 RoleofInteriorMicrocracksonDegradation 266 7.6 AntidegradationMeasures 267 7.6.1 SpecicPreparationProcedures 268 7.6.2 OptimizationofFormula 269 Contents 7.6.2.1 DopantEectsonImprovingACDegradationCharacteristics 270 7.6.2.2 DopantEectsonImprovingImpulseDegradationProperty 271 References 272 8 Praseodymium/Vanadium/Barium-Based ZnO Varistor Systems 281 8.1 PraseodymiumSystem 281 8.1.1 DopingEects 281 8.1.2 EectofSinteringProcesses 285 8.1.3 High-VoltageApplications 288 8.1.4 Low-VoltageApplications 288 8.2 VanadiumSystem 289 8.2.1 DopingEects 290 8.2.2 ElectricalCharacteristics 291 8.2.3 MicrostructuralCharacteristics 292 8.2.4 EectsofVanadiumOxideonGrainGrowth 294 8.3 BariumSystem 295 8.3.1 PreparationandElectricalCharacteristics 295 8.3.2 MicrostructuralCharacteristics 296 8.3.3 ImprovingStabilityAgainstMoisture 298 8.4 ZnO–GlassVaristor 298 References 300 9 Fabrications of Low-Voltage ZnO Varistors 307 9.1 Introduction 307 9.2 ExaggeratingGrainGrowthbySeedGrains 308 9.3 SynthesisofNanocrystallineZnOVaristorPowders 309 9.3.1 Gas-PhaseProcessingMethods 309 9.3.2 CombustionSynthesis 311 9.3.3 Sol–GelMethods 311 9.3.4 Solution-CoatingMethod 315 9.4 NanollersinZnOVaristorCeramics 320 9.5 SinteringTechniquestoControlGrainGrowth 321 9.5.1 Step-sinteringApproach 321 9.5.2 MicrowaveSinteringMethod 322 9.5.3 SparkPlasmaSinteringTechnique 324 References 327 10 Titanium-Based Dual-function Varistor Ceramics 335 10.1 SrTiO3 Varistors 335 10.1.1 Introduction 335 10.1.2 MicrostructureofSrTiO3Varistors 336 10.1.3 PreparationofSrTiO3Varistors 336 10.1.4 PerformanceofSrTiO3 338 10.1.5 ConductionMechanismofSrTiO3 339 10.2 TiO2-BasedVaristors 341 10.2.1 Introduction 341 10.2.2 PreparationofTiO2-BasedVaristors 342 10.2.3 MechanismofTiO2Capacitor–VaristorCeramics 342 10.2.4 DopingofTiO2-BasedVaristors 343 10.2.4.1 Acceptor-DopedTiO2-BasedVaristors 343 10.2.4.2 Donor-DopedTiO2-BasedVaristors 344 10.2.4.3 CodopingEectsofAcceptorandDonorDopants 345 10.2.4.4 SinteringAdditivesinTiO2-BasedVaristors 347 10.2.5 DevelopmentofTiO2-BasedVaristors 348 10.3 CaCu3Ti4O12 Ceramics 348 10.3.1 Introduction 348 10.3.2 StructureofCCTO 349 10.3.2.1 CrystalStructure 349 10.3.2.2 PhaseandMicrostructure 350 10.3.3 PerformancesofCCTOCeramics 352 10.3.3.1 NonohmicCurrent–VoltageCharacteristic 352 10.3.3.2 ColossalPermittivity 354 10.3.3.3 DielectricLoss 357 10.3.4 Mechanism 358 10.3.4.1 IBLCModel 358 10.3.4.2 ConductingMechanism 362 10.3.4.3 PolarizationMechanismofGrains 364 10.3.4.4 APolaronicStackingFaultDefectModel 365 10.3.5 RoleofDopants 366 10.3.5.1 RoleofDopingCuO 366 10.3.5.2 DopingMechanismstoTuneCCTOPerformances 368 10.4 BaTiO3VaristorsofPTCREect 375 10.4.1 Introduction 375 10.4.2 DopingEects 377 10.4.3 PreparationofBaTiO3Ceramics 379 10.4.4 PTCREectofBaTiO3Ceramics 381 10.4.5 VaristorCharacteristicsofBaTiO3Ceramics 384 References 386 11 Tin Oxide Varistor Ceramics of High Thermal Conductivity 407 11.1 PreparationofSnO2-BasedVaristors 407 11.2 ElectricalPerformancesofSnO2-BasedVaristors 410 11.3 MechanismofSnO2-BasedVaristors 414 11.3.1 FormationofGrainBoundaryPotentialBarrier 414 11.3.2 AtomicDefectModel 415 11.3.3 AdmittanceSpectroscopyAnalysis 417 11.3.4 Capacitance–VoltageAnalysis 420 11.3.5 EectofThermalTreatment 421 11.4 RoleofDopantsinTuningSnO2-BasedVaristors 423 11.4.1 DopantsforDensifyingSnO2-BasedVaristors 423 11.4.2 AcceptorDoping 424 Contents 11.4.3 DonorDoping 427 11.5 ThermalPerformances 429 11.6 DegradationBehaviors 431 11.7 DevelopmentofSnO2-BasedVaristors 432 References 434 12 WO3-Based Varistor Ceramics of Low Breakdown Voltage 441 12.1 Introduction 441 12.2 TungstenOxide 442 12.3 PreparationofWO3-BasedVaristors 444 12.4 ElectricalPerformances 446 12.5 ImprovingtheElectricalStability 448 12.6 MechanismModelofWO3-BasedVaristors 449 12.7 DopingEects 452 12.7.1 TheAdditionofRareEarthOxides 452 12.7.2 TheAdditionofCuO 453 12.7.3 TheAdditionofAl2O3 454 12.7.4 TheAdditionofTiO2 455 12.7.5 TheAdditionofOtherAdditives 455 References 456 Index 461 |